. CAESIM 2024 - Electronics

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Electronics

As the electronics industry tends to put more components into a smaller space, thermal management has become one of the key factors in designing the new generation of computers and many other electronic devices. Computational fluid dynamics simulations can help optimize cooling system design, thereby increasing components lifetimes and minimizing the possibility of hardware errors.

CAESIM has been used for simulating air flow and heat transfer of electronic systems including: heat sinks, individual components, multi-chip modules, and computer boards. As electronics are put into a smaller spaces, thermal management becomes a key factor in designing the new generation of computers.

Electronics Applications

Thermal Analysis - Magnetic Assembly

CAE has been utilized to simulate conductive and convective heat transfer for a magnetic assembly configuration.  The magnetic assembly is comprised of many components made of aluminum, copper, ferrite, and paper.  Volumetric heat sources are added for the heat generating assembly components.

Heat Load - Filter Device

CAE has been utilized to simulate a filter device with various heat loads (e.g., 0.25 W).  An external heat load is applied, and a bi-conjugate linear equation solver is used to obtain fast solution convergence to steady-state conditions.

Computer Server Rooms

CAE simulations are widely used to evaluate/validate thermal conditions in computer server rooms.  Performance of computer rack system configurations with varying heat loads can be assessed quickly and accurately.

Electronics Simulations

Electronic Chips

Electronic diode conjugate heat transfer simulation

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Arc Blast

Electronic breaker high pressure blast

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Heat Sink

Pin-fin type heat sink conjugate heat transfer

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Computer Chassis

Simulation of tower computer with components

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Capacitor

Heat transfer simulation of capacitor

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Computer Server Room

Transient simulation of several computer rack systems

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Magnetic Assembly

Conjugate heat transfer of magnetic assmembly device

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Multiple Heat Sinks

Conductive and convective heat transfer of multiple heat sinks

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Heat Sink - Round Fins

Conjugate heat transfer of heat sink with round pins

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Electronic Filter Device

Custom heat load simulation of electronic filter device

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Additional Information

HEAT TRANSFER Modeling

Electronics

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CAESIM STORM Flow Solver Benchmark

Electronics

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Applications

CAESIM Software

Technical Reports

Solution Galleries

Information

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